How to strengthen BGA to prevent cracking

The circuit board deformation usually comes from the rapid heating and rapid cooling caused by high temperature reflow soldering, coupled with uneven distribution of parts and copper foil on the circuit board, so the deformation of the circuit board is worsened. Then, how to strengthen the circuit board BGA circuit board to prevent cracking it?

Method for increasing deformation resistance of circuit board:

* Increase the thickness of PCB
If possible, it is recommended to use more than 1.6mm of the thickness of the circuit board,

* Use high Tg PCB material
High Tg means high rigidity,

* Put steel around BGA
If there is space, think about it, like building a house, put steel around BGA.

* Fill the circuit board with Epoxy glue
Also consider glue around the BGA or the back of the corresponding circuit board, to strengthen its resistance to stress.

Reduce the amount of deformation of PCB:

Generally speaking, when the circuit board (PCB) is assembled to the chassis, it should be protected by the casing, but because today's products are becoming thinner and thinner, especially handheld devices, the circuit board is deformed by force.

Reduce the deformation caused by an external force on a circuit board, there are the following methods:

*Increase the buffer design of the mechanism to the circuit board

*Insert screws or positioning mechanisms around the BGA.

*Strengthen the case strength to prevent it from deforming and affecting the internal circuit board

Enhance the reliability of BGA

*Pour glue at the bottom of the BGA.

*Increase the size of the BGA pad on the circuit board

*Using SMD layout

*Using Vias-in-pad design

*Increase soldering capacity

*If it's already finished, It is best to use "Stress Gauge" to find the stress concentration point of the circuit board.

Eight kinds of PCB surface treatment process

With the continuous improvement of human living environment requirements, the environmental problems involved in the PCBproduction process are particularly prominent. The topic of lead and bromine is the hottest, Lead free and non halogenated will affect the development of PCB in many ways.

Although for now, The surface treatment process of PCB has not changed much, But it should be noticed. Long periods of slow change will lead to dramatic changes. In the case of increasingly high environmental protection voices, The surface treatment process of PCB will certainly change greatly in the future.

The basic purpose of surface treatment is to ensure good solderability or electrical properties. Because copper in nature tends to exist in the air in the form of oxides, unlikely to remain as raw copper for a long time, So copper treatment is therefore necessary.

here are many PCB surface treatment processes now, following will be introduced one by one:

* HASL
Hot air leveling, also known as hot air solder leveling (commonly known as tin spray), It is the process of coating molten tin (lead) solder on the surface of PCB and blowing (blowing) flat with heated compressed air, and make it a layer that is resistant to copper oxidation, and supply coating with good solderability. During the hot air, solder and copper combine to form copper tin intermetallic compounds.

* OSP
OSP also called Organic Solderability Preservatives, Simply speaking, OSP is on the surface of cleaning bare copper, chemically grown a layer of organic film. The film has oxidation resistance, heat shock resistance and moisture resistance. Used to protect the surface of copper from corrosion in the normal environment.

* Full plate nickel plated gold
The gold plated nickel plate is plated with a layer of nickel on the surface conductor of PCB and then plated with a layer of gold. Nickel plating is mainly to prevent the diffusion of gold and copper. Soft gold is mainly used in chip packaging gold wire. Hard gold is mainly used in non welding electrical interconnections.

*  Immersion Gold
The gold is a thick, electrically charged nickel alloy on the copper surface. this can protect PCB for a long time. In addition, it has the environmental tolerance that other surface treatment processes do not have. Immersion  gold can also prevent the dissolution of copper.

* Immersion Tin
Since all solders are based on tin, the tin layer matches any type of solder. Tin deposition process can form a flat copper tin intermetallic compound.

* Immersion silver
The silver deposition process is between organic coating and electroless nickel plating / immersion, the process is simple and fast. Silver can still maintain good solderability even when exposed to heat, humidity, and contamination.

*Electroplated hard gold

In order to improve the wear resistance of products, increase the number of plugging and electroplating hard gold.

Cause analysis of PCB price difference

The cost of the PCB industry is the most extraordinary and complex of all industries, from the opening, platen, forming, until the FQC, packaging, finished warehousing. According to the cost of each process inputs, labor costs, manufacturing costs, such as step-by-step accounting, Then, according to the order product number, the cumulative cost. All of these affect the calculation and evaluation of WIP cost and scrap cost directly.

First, different materials used in PCB result in price diversity.

Materials are generally FR-4, CEM-3 and so on, thickness ranges from 0.6mm to 3.0mm. Copper thickness varies from Oz to 3 Oz. All this creates a huge price difference on the sheet metal.

Second, The diversity of manufacturing processes used by PCB creates price diversity.

Different production processes lead to different costs.

Third, the price diversity caused by the difficulty of the PCB itself.

Even the same material, the same process, But the PCB itself is difficult and creates different costs. 
The difficulty of the retirement rate is higher, and Inevitable cost increase, And then create price diversity

Fourth, Different customer requirements can also lead to price differences. 
The level of customer requirements will directly affect the rate of finished products in the factory, Such as a board according to IPC-A-600E, Class1 requirements have 98% pass rate, but according to class3 requirements may be only 90% of the qualified rate, resulting in different costs of the board factory, and finally lead to variable product prices.

Fifth, Price diversity caused by PCB manufacturers.
Even with the same product, but because different manufacturers, process equipment, technical level is different, but also the formation of different costs.

Sixth, Price differences caused by different payment methods

At present, the PCB board factory will adjust the PCB price according to the different payment methods, the range is 5%-10%, which makes the price difference.

Seventh, Regional differences lead to price diversity.

At present, the domestic geographically speaking, from south to north, the price has increased, there are some differences in prices in different regions.

PCB industry

PCB industry

2016 collapse of the traditional manufacturing industry, in 2017 the Internet bubble collapse.Enterprise transformation is a top priority to reverse the crisis.Transition, the two words are related enterprise life and death.Especially large enterprises, with annual sales of $10 enterprises, rely on is the traditional sales channels and team, talk easy transition.Die not transformation, transformation in the fear of death,Many enterprises are struggling with this is the main reason for the transformation,Timid fear the end of the "death" is the only result.Even if is dead, why don't you fight, the profit?

For the enterprise, there are two kinds of transformation:
The first kind, forced to transition, while concentrating on the problem can't solve,Reversed transmission enterprise transformation, the transformation cost is very big, also is very painful, but not the operation must be death.
The second transition, is foreseen type transformation,Is the enterprise leaders strategic insight ability strong, this kind of entrepreneur is scarce,Like that year sell PC business to lenovo, IBM is near the cheap PCS sold a high price in advance,IBM finished ahead of transformation, was very successful.But this kind of entrepreneurs in the world is rare.
Believe most of the PCB manufacturer and upstream and downstream industries are belong to the first, when the flood comes, to remember to disaster relief, the concept of no save for a rainy day.
In artificial cost, cost of raw materials under the trend of growing only, also hope to rely on bite a tooth proofed the past is not too realistic, this will only drag companies to more and more tired, tired, ending only exit the market, of course.
First of all, China has now entered the medium high income countries,Compared to income levels in the global ranking of a substantial increase in twenty years ago.More than 110 economies around the world have more than the Chinese labor cost advantage, domestic labor costs increase, have to make industrial enterprises use replace labor of science and technology innovation.
Second, the PCB industry use are traditional copper clad,And circuit board prices the main reason is that the upstream copper clad, copper foil and other raw material prices continue to rise sharply, cause the entire circuit board production cost is too high,Semi-serious also makes the downstream industry, in addition, the popularity of electronic products upgrading and increase the terminal market demand, this also support factor for the circuit board price is rising.
Avant-garde entrepreneurs recognize industry already on the market situation, vision, breaking the previous sheet, use ceramic material of the circuit board,And the ceramic chip price did not increase,In this regard, the ceramic material used in the circuit board industry has greater advantage.And also using laser rapid activation metallization technology (LAM) technology, reduce labor costs, laser cutting grinding punch master, production cycle is fast, good heat dissipation effect.Easily solve the artificial cost and material cost, and also bring more value.

Wireless charger design and analytical – circuit selection principle

Wireless charger design and analytical - circuit selection principle
Wireless charger is not the traditional charging the power cord is connected to the need to recharge on the terminal equipment of the charger,Using the latest wireless charging technology, through the use of magnetic field between the coil,Magic power transmission, inductive coupling technology will become the bridge connecting charging stations and equipment.
Most of the current charger, tablet and iPhone, for example, by means of direct contact with the metal wire, to the device with a built-in battery.Wireless charging technology has the advantage of convenience and versatility.The disadvantage is low efficiency and can only provide electricity.And Apple Dock connector not only provide electricity, as well as the audio and video files via USB sync on the device.However, wireless charging technology will bring progress to WiFi and battery technologies.For does not require data transmission equipment, this new technology will greatly reduce the number of user needs all kinds of charger.In addition, through the adoption of wireless charging technology, public mobile charging stations will likely become a reality.
Wireless charger principle and structure

Figure 1 wireless charger principle and structure
Wireless charging system mainly adopts electromagnetic induction principle, to realize the energy transfer through the coil energy coupling.As shown in figure 1, the system will work when the input ac mains by full bridge rectifier circuit into direct current, or directly with 24 v direct current for power supply system.After H H power management module of the output dc by 2 m active crystals into high frequency inverter ac supply primary winding.Through 2 H H inductor coil coupling energy, electricity flows through the secondary coil output to accept change to dc conversion circuit for the battery.
The power management module

Figure 2 power supply circuit

Emission circuit module

Figure 3 emission circuit module

As shown in figure 3, the main vibration active crystal up 2 MHZ used for oscillator circuit.Active crystals square-wave output, a second-order low-pass filter filter HHG, get stable sine wave output,The triode 13003 and its peripheral circuit composed of c class after the amplifier circuit output to coil with parallel resonant circuit of capacitance radiation. Provide energy for receiving part.
Receiving circuit module and charging circuit

Figure 4 receiving circuit
Measured with parallel resonant circuit of capacitance of tubular coupling coil wire diameter for o. 5 mm, 7 cm diameter, inductance of 47 uh, carrier frequency of 2 MHZ.According to the parallel resonant formula to match the capacitance C is about 140 pf.Thus. Launch part adopts 2 MHZ active crystals produce energy carrier frequency and resonant frequency is close to.

Figure 5 charging circuit

Wireless charger basic function is through the coil will be H electricity H in H H wireless transmission to the battery.Simply put battery and receiving device on the charging platform can be recharged.Experiments show. Although the system also can't charging in invisible. But have more than one school can do to charge platform charging at the same time, placed in the same connection problems.

Wireless transmission can charger circuit analysis – circuit selection

Wireless transmission can charger circuit analysis - circuit selection
Wireless charging is the result of radio transmission technology, low power wireless charging electromagnetic induction type, is often used to power wireless charging resonant is often used by power supply equipment (charger) to transfer energy to the utilization device, the device using the received energy of the battery, and at the same time for its own operation.
Because of the energy between the charger and power device to transmit field, without wires, between so charger and electric device can do no conductive contact the leakage.
Introduced in this paper is a simple and practical scheme of wireless transmission to the charger, it is through the coil to transmit power wireless to the bulb (battery).The wireless transmission can charger by two major part is energy sending unit and receiver unit, can be within 5 cm for rechargeable bulb (battery).
The power supply circuit

Using the 24 v and 5 v power supply to supply power field effect tube namely NE555 respectively by use of transformer substation using 7812 and 7912 the voltage source module to produce 24 v points and then by the power supply voltage to produce 7805 5 v battery.And it is important to note that two power supply.
Signal circuit

Applied by NE555 oscillation frequency is about 500 KHZ signal generator, excitation signal for power amplifier circuit.Adjust the rheostat size of 555 May be changes in a certain range of the output pulse frequency and duty ratio, and get the required frequency adjustment.
Receiver charging control circuit design

Electricity after receiving coil, high frequency ac voltage through IN4007 full-wave rectifier rectifier tube, 2200 uf capacitor filter, and then woke up with 3.3 V zener diode voltage, the output direct current for the bulb (battery) to provide a stable working voltage.
Power amplifier drive circuit
By LC resonance power amplifier and parallel resonant circuit switch tube IRF640 composition.Front-end oscillation circuit of power amplifier drive circuit is mainly used for amplification of vibration signals, thus send the higher oscillation signal in the junior high frequency power circuit.
LC resonance circuit design
Rf output energy sending unit adopts the transmitter coil (inductance and capacitance) and constitute a resonance circuit.Gain more voltage, in order to improve the energy receiving unit is able to work at greater distances, energy receiving unit adopts parallel resonant circuit.
When power amplifier circuit of frequency selective resonant frequency and the excitation signal frequency at the same time, the power amplifier in resonance, the maximum voltage and current in coil, resulting in a maximum of alternating electromagnetic field.When the receiver coil and the transmitter coil near the output voltage is induced in the receiving coil, when the resonance frequency of the receiver coil circuit and transmitting frequency resonate at the same time, the voltage of the maximum value.So the transmitter coil circuit and receiving coil circuit are in a state of resonance, has the best effect of energy transmission.Coil transfer energy efficiency is higher, the greater the distance between.
Receiver charging control circuit design
Electricity after receiving coil, high frequency ac voltage through IN4007 full-wave rectifier rectifier tube, 2200 uf capacitor filter, and then woke up with 3.3 V zener diode voltage, the output direct current for the bulb (battery) to provide a stable working voltage.

The wireless transmission  charger solutions and improvement need pay attention to the following points:
(1)in the transmission distance, under the condition of coil parameter is set, the sender must have the higher frequency, the transmitting coil in the resonance state, etc. Make transfer efficiency increases.
(2)methods for the improvement of distance is to improve the transmission circuit of voltage.
(3)the design adopts IN4007 rectifier rectifier tube, pipe pressure drop an average of 0.8 V.Conduction loss is big, not suitable for use in the receiving circuit.And if the schottky diode can greatly reduce the loss of the pipe, electrical energy utilization is higher.
(4) copper wire diameter, coil diameter size, number of turns and winding method not only determines the coil inductance value, also affects the efficiency of its transport.

Signaling speed limit and circuit board microminiaturization request

Along with the computer run speed rise, between the central processor and the peripheral component information transmission and the signal deposit and withdrawal needs in extremely short instantaneous to complete.For example within nanosecond or shorter time (10-9 second ~10-10 second).
These the fast transmission signal are carries on between the chip in the printed circuit panel metallic conductor.It is well known, signal dissemination demand time.The detention influence speeds up along with the frequency enlarges.Signal delay in electric circuit panel biggest, is small on multi-chip module (MCM), is smallest on the chip.Therefore the MCM technology is suitable for the high performance system.Is the 90's hot spots.In here us wants to point out the MCM technology arrived this new century to wither largely, its reason was the production cost too is expensive.

The present 3D chip superimposition technology looked like substitutes the MCM technology.In order to reduce the signal delay, may the component which corresponds mutually draw close to the placement.
Reduces between as far as possible them the signal path of propagation.This proposed to the electric circuit board the microminiaturized request, reduces the foundation plate 'OR' circuit board material the dielectric constant to increase the signal running rate.This proposed to the electric circuit board the microminiaturized request, reduces the foundation plate 'OR' circuit board material the dielectric constant to increase the signal running rate.In order to satisfy the component which mutually will correspond to draw close to the placement the request, will have to make the high density interconnection foundation plate/electric circuit board.
Most components will interlock in the smallest space.Is uses the micro channel interconnection technique in the technical stratification plane and unifies the precise narrow spacing metal fine lace technology.

The thing often has the duality, besides the manufacture difficulty, the thin metal wire does not favor the transmission high speed signal.Leading
The wire is thinner, the high speed signal passes ability is lower.Therefore in design high speed movement system time must the concurrently density and the speed request.When to high speed signal transmission line, must use certain section according to the signal velocity request the heavy line.And maintains the enough line spacing to prevent the disturbance between the signal.

six big skills to Chooses the PCB components

1. to consider the part package choice. 
In the entire schematic diagram plan stage, we should consider the confirmation of the part package which makes in the domain stage and welds the plate design decision.Below has given when according to the part seal choice part needs to consider some suggestions
2 use good earth method.
Guarantees that there is enough shunt capacitance and horizon.When use integrated circuit, guarantees arrives in the nearness power source end (should better be horizon) position use appropriate decoupling electric capacity.The electric capacity appropriate capacity is decided by the concrete application, the electric capacity technology and the operating frequency.When the bypass electric capacity lays aside between the power source and the earth pin, approaches the correct IC pin place, may optimize the electric circuit the electromagnetic compatibility and the susceptivity.
3. assignment hypothesized part package.
Prints bill of materials (BOM) to use in inspecting the hypothesized part.If the hypothesized part correlation package,it can not be able to transmit to the domain stage.Founds a bill of materials, then in examination design all hypothesized parts.The only clause should be the power source and the place signal, because they were considered is the hypothesized part.If only carries on special processing in the schematic diagram environment, cannot be transmitted to the domain design.Only if uses in the simulation goal, demonstrates the part in the hypothesized part all to be supposed to use to have the seal part substitution.
4. guarantees you to have the integrity bill of materials data.
whether The inspection bill of materials reported has the enough integrity data or not ?After founds the bill of materials report, must carry on the careful inspection, to all part clause in incomplete component, supplier or manufacturer information supplement integrity.
5. To sort according to the components marking .
In order to be helpful to bill of materials sorting and the examination, guarantees the part marking is the continual serial number.
6.to inspect unnecessary gates.
Generally speaking, all unnecessary gate input all should have the signal connection, avoids the input end being hanging.Guaranteed you to inspect all unnecessary or the omission gate, and all did not have the segment input end all completely to be connected including the above.In some situations, if the input end is at the suspended state, the overall system all cannot work correctly.Take the double transports puts for example,to which is used frequently in the design .If the double land transport put in the IC part only to use one to transport puts,The suggestion either transports another puts also uses, either will not use the input end earth which will transport puts.And the cloth puts an appropriate unit gain (or other gains) feeds back the network, thus guarantees the entire part to be able the normal work.

Analysis of circuit board welding defects

There are three main factors that cause welding defects:

*The weldability of the hole affects the welding quality.

It will cause weld defects if the hole welding is not good, affect the component parameters in a circuit, and lead to the instability of multilayer board components and inner conductor, and finally cause failure of the entire circuit function. The so-called weldability is that the metal surface is wetted by the molten solder, that is, the solder metal surface to form a relatively uniform and continuous smooth film.

*Weld defects due to warping

Circuit board and components in the process of welding warp, due to the stress deformation and weld defects such as short circuit. Warpage is often due to the temperature of the upper and lower parts of the circuit board caused by the imbalance of the board itself due to the weight of the warp.

*PCB design affects welding quality

In the layout, the size of the circuit board is too large, the printing line is long, the impedance increases, the anti noise ability drops, the cost increases.

How to optimize the PCB file?

1.Shorten the connection between high frequency components, reduce EMI interference.

2.A heavy weight (e.g., over 20G) element, which is supported by a bracket, and then welded

3.Heating element to consider the problem of heat dissipation, heat sensitive components away from the heat source.

4.The arrangement of the elements is as parallel as possible, so that the utility model can be beautiful and easy to weld, and is suitable for mass production.

Welding methods and skills for a new PCB board

For the new PCB board, we must look at the board first, whether there are problems, such as whether there are obvious cracks, there is no short circuit, open circuit, etc.

If necessary, check if the resistance between the power supply and the ground is large enough. Then install the component. In general, the power can be installed in the first part, and then on the power supply output voltage detection is normal. If you do not have too much confidence in the grasp, it’s a good idea for adjustable regulated power supply with current limiting function. The preset is better than the current protection, and then the voltage of the power supply is slowly increased, and the input current, input voltage and output voltage are monitored. If there is no over-current protection and other issues during process, and the output voltage is also normal, then the power part OK. 

There are several ways to find fault.

Measuring voltage method

First of all, we must confirm that the power supply voltage of each chip is normal, and then check the reference voltage is normal, there are other points of the operating voltage is normal, etc.

Signal injection method

The signal source is added to the input end, and then the waveform of each point is measured in turn to see if the fault is normal to find the fault point. Sometimes we use a simpler approach, for example, with a hand holding tweezers to touch the input at all levels to see whether the output response, if you do not respond to the first level, and after the first reaction, then the problem at the previous level, should focus on inspection.

Of course, there are many other ways to find fault points, such as seeing, hearing, smelling, touching, etc.

"Look" is to see whether there are obvious mechanical damage components, such as rupture, burning black, deformation, etc.

"Listen" is to listen to the sound of the work is normal, such as something that should not ring in the ring, the sound of the place does not ring or abnormal sound, etc.

"Smell" is to check whether there is a smell, such as the smell of burning, the taste of electrolytic capacitors, etc., for an experienced electronic maintenance personnel, the smell is very sensitive.

"Touch" is to use the hand to test whether the device temperature is normal, such as too hot, or too cold. Some power devices, should fever when work, but if it is cold, it can be judged that it does not work. General power transistor, voltage regulator chip, working at 70 degrees below is completely no problem. 

flight controller hardware structure and circuit2

Comparing uav remote sensing satellites and manned aircraft platform, has the characteristics of low cost, high flexibility.In order to satisfy the science remote sensing experiment, remote sensing work task, coordination of unmanned aerial vehicle (uav) multiple components in electronic pod working posture, control, remote sensing image sensor,System AT89S52 as the main control chip, expand multi-channel serial and USB interface so as to realize the communication system and peripheral equipment, and design the camera driver module and three dof stepping motor driver module.Through the uav remote sensing experiment proves that the system can satisfy the requirement of remote sensing experiment.

USB extension circuit design

USB extension by CH375 chip implementation.The general interface chip CH375 is the USB bus.Its main characteristic is cheap, convenient interface and high reliability.Support USB - HOST HOST way and way of USB DEVICE/SLAVE DEVICE.CH375 commonly used way of USB host support USB device at full speed, the external need to write the firmware program MCU in accordance with the relevant USB protocol and USB communication.But for common USB Storage devices, CH375 built-in firmware can automatic processing Mass - Storage Mass Storage equipment dedicated communication protocols,Normally, the external microcontroller don't need to write the firmware program. Can directly read and write data from USB storage devices.CH375 and MCU communication there are two ways: parallel and serial mode.USB extension circuit principle diagram as shown in figure 3, CH375 chip set to the built-in firmware mode, use 12 MHz crystal.SCM P0 port connected with the CH375 D0 ~ D7 as a data bus, decoder output connected pieces selected the chip CH375, microcontroller A0 and CH375 A0 is linked together, the choice of CH375 address and data input and output.When A0 to high level is the address of the transmission is D0 ~ D7, low electricity at ordinary times is the data transmission.P3.6 and P3.7 control of CH375 to read and write operation respectively.MCU input CH375, when there are data input through the USB port the interrupt signal, notify the single-chip computer for data processing.When CH375 chip initialization and successfully connected with the master, indicator.

Stepper motor drive circuit

Stable yuntai control three degrees of freedom for stepper motor control, the control of the remote sensing sensor pitch Angle, roll Angle and course Angle to keep stable yuntai horizontal (or vertical) state.Stepping motor driven by THB6128 chip implementation, microcontroller only output step motor running direction and the pulse signal can achieve the goal of control of stepping motor.

THB6128 is high subdivision, special chip two-phase hybrid stepping motor driver output control signal by single chip microcomputer, can design a high performance, multiple subdivision drive circuit.Its characteristics for both bridge MOSFET drive, low on resistance Ron Ω = 0.55, the highest 36 V voltage, large current 2.2 A (peak), A variety of optional segment, up to 128 segments, half with automatic locking function, fast, slow decline, optional hybrid three decay modes, built-in temperature protection and over-current protection.Figure 4 for the heading Angle of stepper motor drive circuit, pitch Angle and roll Angle of the stepper motor driver with the same.Figure in the CP1 and U/D of single chip microcomputer is given respectively drive pulse with the motor running direction of control signal.M1, M2, and M3 for motor drive fine points selection signal input, controlled by the dial the code switch artificially.FDT1 and VREG1 attenuation model respectively to choose voltage and current control voltage input end.When 3.5 V for slow attenuation model;When the attenuation model for mixed;When FDT1 "0.8 V for fast attenuation model. Adjust the voltage of the VREG1 can set stepper motor drive current value.

flight controller hardware structure and circuit1

In the uav flight control system, flight controllers is its core component,It is responsible for the flight control system of signal acquisition, calculation of control law, the posture and speed of the aircraft, and the communication with ground equipment, etc.As uavs become more widely used, its task is becoming more and more complex, and mobility requirements for unmanned aerial vehicle (uav) is becoming more and more high, this request of unmanned aerial vehicle (uav) control core to develop in the direction of high integration and miniaturization.

In a 586 - Engine embedded chip as the core, the design of a certain type of unmanned aerial vehicle (uav) flight controller, system hardware structure is introduced and the corresponding software flow, and the simulation results is presented.

The 586 - Engine main parameters as follows:

• for 32-bit AMD CPU Elan SC520, frequency of 133 MHZ;
• the high performance of floating point arithmetic unit, support complex operations, such as sine, tangent, logarithmic, very suitable for need to the application of complex operations.
• the configuration 512 KB SRAM, 512 KB of Flash, 114 bytes in the internal RAM;
• support 15 external interrupt.A total of seven timer, including internal a programmable timer, provide 3 16-bit internal timer and 3 16 GP timers, plus a software timer.The timer support external event timing and counting.Software timer provides microsecond time hardware benchmark.
• provide 32 programmable I/O, 2 UART.A total of 19 road 12 bit A/D input, including 11 parallel ADC ADC serial input and 8 road, switching frequency is 300 KHZ;No.6 D/A output, including two serial output DAC and four output parallel 12 bit DAC, switching frequency is 200 KHZ.
• working temperature for - 40 ℃ ~ 80 ℃, the size of 91.4 mm&Times;4 mm&Times;7.6 mm.

The type of unmanned aerial vehicle (uav) is to provide communications relay for navy combat troops use medium wheeled unmanned aerial vehicle (uav), the flight controller is a separate packing small airborne electronic equipment,By DC/DC DC power conversion board, the computer motherboard, analog channel plate, the switch quantity of channel plate and steering gear control board,All templates by bus on the motherboard connection, to reduce the size, improve the level of integration.

Detailed below flight controllers of data collection, information transmission and control output, etc.

(1) serial port extension

The figure 1 shows that the flight controller needs with GPS, magnetic heading of communication and radio altimeter, a total of five serial port.586 - Engine motherboard only provide two serial ports, respectively for the use of ground test and measurement and control stations, so the need for a serial port extension.A serial port extension circuit is shown in figure 3.

Serial port extension circuit adopts the TL16C754 UART and four channels - string conversion device, the 8-bit parallel data into serial output 4 road, plus MAX202 and MAX489 level conversion chip, expanded the 2 RS232 serial interface and 2 RS422 serial port, can meet the hardware requirements of flight controller.

• D/A conversion

The uav using simulated steering gear, A total of 6 D/A channel PWM signals to drive the servo.586 - Engine motherboard provides 8 D/A, A total of 4 road 12 parallel D/A (DA7625) were about to rise and fall control steering gear, the aileron servo and the direction of steering gear, 2 road 12 serial D/A (LTC1446) front wheel steering and throttle servo control.Because DA7625 output voltage in the range of 0 ~ 2.5 V, LTC1446 output voltage range of 0 ~ 4.096 V, and steering gear working voltage for - 10 ~ 10 V, so need to signal amplification and translation.D/A level translation circuit as shown in figure 4.

Level by the figure, the D/A conversion principle is adopted in op-amp input addition circuit, the input signal and the reference level proportion together, get the voltage range suitable for sampling.Input level

and the relationship between the output leve

• A/D acquisition

586 - Engine motherboard own 19 road 12 bit A/D interface completely meet the accuracy requirement of the channel number and the transformation of A flight control system, the A/D interface of barometric altimeter data respectively, uav airborne voltage, Engine speed and temperature, the throttle opening and so on.These signals sent to the ground tt&c computer for operators for unmanned aerial vehicle (uav) working state monitoring provides the basis.

• the I/O control

586 - Engine motherboard provides 32 16 programmable digital I/O port, used for acquisition, umbrella compartment open the Engine starting signal, etc., and the output switch signal control and other equipment, take-off and recycling process control of unmanned aerial vehicle (uav).

• power supply module

Flight controller of power supply module circuit for flight controllers provide a clean and stable power supply voltage, used to guarantee the normal work of the flight controllers.Power supply module circuit design is good or not directly affect the flight controller running stability and reliability.Due to the size of the unmanned aerial vehicle has certain requirements, at the same time, considering the reliability and cost, so use in the design of the mature standard module power supply, external work with little or no device.Flight controllers of power supply module circuit is shown in figure 5.

Among them, with 24 t05d12 module power as the main chip of the power supply circuit, provided by the power of 30 w, input voltage range to 18 v ~ 36 v, output power has three road: + 5 v and + 12 v, the power supply for airborne sensors and steering gear.

Made of led light circuit diagram

1,Figure 1 is for capacitance ballast circuit.The C1 Values determine the size of the working current .Working current normally is 12mA-15mA,and Within this scope LED is safe.We can cancel R2,C3 according to the situation .
2, Figure 2 is for the constant current source circuit.The R3 Values determine the size of the working current .When it is 30Ω,the Working current is 12mA.The VT1 voltage at the ends of the collector and emitter=the voltage for the two ends of C2 -The LED pressure drop*N .More the quantity of LED the is , lower VT need resistance to pressure and power.When the quantity of LED the is more ,We can use MJ13001 for VT1.
3, If the quantity of LED the is less ,We can use Figure 1 circuit .While the quantity of LED the is more ,We can use Figure 2 circuit .In terms of cost performance, Figure 2 circuit is the first selection.
4, The quantity of LED the is more ,the higher the energy utilization efficiency is .For example,Working current normally is 15mA(This value not only can make sure the brightness ,but also make sure the LED security)However the quantity is 1 or 90,Electric current is equal because led is In series .The power of the circuit P=220V*1.414*0.015A=4.67W.If 10 LED is used,and the pressure drop is 3.1V,then the power is 10%.While the rest is lost on the ballast or constant current source .But if 90LED is used,then the power will up to 90% .So it’s better to use more LED ,which can increase brightness In proportion,reduce the financial burden on the power part and Increase the reliability.
5, Leds classified two types :concentrated and astigmatism .For the concentrated type,Brightness is concentrated , range is far but it has a halo,which is applicable to the emergency light, flashlight, etc.While for astigmatism type ,Brightness is Scattered and soft,but it own a shorter distance,which is suitable for indoor lighting, desk lamp, etc. (can be mixed with a certain amount of concentrating)
6, There is a trick to choose LED:The bigger Light emitting chip ( visible phosphors in the LED)is ,the brighter the light will be .

PCB design relevant skills

Set skills 
All point design in different stage requires different Settings,
In the layout phase a large lattice can be used in device layout;For big components such as IC, connectors which are not located, we can choose 50 ~ 100 mil lattice accuracy to device layout .While for passive components such as resistance capacitance and inductance,we can choose 25mil.he precision of the large lattice is advantageous to the alignment of the device and the layout beautiful.
PCB layout rules:
1, Normally all components shall be arranged on the the same circuit board side.Only top-level components is too close, some device height is limited and small calorific value device be set up on the bottom ,Such as SMD resistor, SMD capacitors, SMD IC.
2, on the premise of guarantee the electrical performance,elements should be placed on the grid in parallel or vertical alignment in order to be neat, beautiful.In general we don't allow components overlap,but to compact arranged components .Components in the page layout should be uniform distribution, the density is consistent .
3,Different components on printed circuit boards, neighboring,and the minimum distance between solder graphics should be more than 1 mm .
4,The distance from Components to the circuit board edge is generally not less than 2 mm.The best shape for the circuit board is rectangular and aspect ratio is 3:2 or 4:3. When Circuit board face 'is greater than 200 mm by 150 mm, we should consider mechanical strength which circuit board can withstand .
Layout skills
In the layout of the PCB design to we should analyze circuit unit according to the function.Layout all the components of the circuit , we need to comply with the following principles:
1, Arrangement of each functional circuit unit according to the process of the circuit to facilitate signal flow and ss far as possible to maintain the signal consistent direction.
2,Centered on the core of each function unit components, we layout around it .The arrangement of components should be uniform, compact, on the PCB and we should as far as possible reduce and shorten the lead and the connection between each components.
3,For the circuit which works under high frequency , we need to consider the components distribution parameters.Generally components should be as far as possible made parallel arrangement ,which are beautiful, and easy fabrication, easy to mass production .

Method for quickly detecting fault of PCB board

PCB board production is not a simple process to finish the board, and drill a hole. PCB production is not difficult, the difficulty lies in the completion of the troubleshooting. Whether it is a personal enthusiast or industry engineer, for the PCB circuit board debugging problems encountered when it is also quite a headache, like programmers encounter BUG. Common problems in addition to circuit board design, electronic components of the damage, circuit short circuit, the quality of components, PCB circuit board disconnection fault is not a minority.

Common circuit board fault is mainly concentrated on the components above, like capacitors, resistor, inductor, diode, transistor, FET, integrated chip with obvious damage of the crystal, and the method of judging these components fault more intuitive through the eyes to see. There are obvious damage to the surface of electronic components have more obvious traces of burning. Like this kind of fault, the problem can be solved by replacing the new component.

Of course, not all of the electronic components damage can be observed with the naked eye, resistance, capacitance, as mentioned above, two or three diodes, and in some cases the damage is not from the surface to see, the need for maintenance by professional inspection tools, commonly used for inspection with multimeter, capacitance meter etc. and electronic components to a voltage or current in the normal range in the detection, the components or previous components problems, then check to see if the normal direct replacement. 

But sometimes when we give PCB board components, will encounter the problem is not detected, but the circuit board and can not be operated normally. Many novice encounter such problems MEIZHE, only to re do a board, or buy a piece of. In fact, in this case, a lot of time in the process of installation of components, due to the coordination of the various components of the problem, there may be unstable performance. In this case, the instrument has been unable to help, try to determine the range of possible fault, according to the current and voltage to reduce, experienced engineers may be able to determine the fault area quickly, but the specific components which can not determine the bad 100%. The only way to do this is to try to replace the suspect until you find the problem.

The above said is the electronic components of the problem, of course, since the PCB circuit board as components, so the circuit board fault must also exist, the most simple example of die tin parts, due to the production process, the PCB corrosion process, there may be a problem is broken. In this case, if you can not make up the line, then you can only use fine copper wire.

FPC hole metallization and copper foil surface cleaning process

* Fabrication technology of double sided FPC

The hole metallization of flexible printed circuit board is basically the same as that of rigid printed circuit board. In recent years, there has been a direct plating process, which is replaced by electroless plating and the formation of carbon conductive layer technology. This technique is also introduced in the fabrication of flexible printed boards.

Flexible printed circuit board needs a special fixture because of its soft, , the fixture can not only put the flexible printed board is fixed, but also must be stable in the bath, or copper plating thickness is not uniform, which is an important cause of breakage and bridging in the etching procedure. In order to obtain a uniform copper plating layer, the flexible printed circuit board must be tightened in the fixture, and the position and shape of the electrode should be used.

* FPC cleaning process for copper foil surface

In order to improve the adhesion of the resist mask, it is necessary to clean the surface of the copper foil before coating the resist mask.

General cleaning chemical cleaning process and mechanical grinding process for manufacturing precision graphic, is the two most occasions clean technology combined with surface treatment. Mechanical polishing using the method of throwing brush, polishing material will cause damage to the copper foil, too soft and will not be fully grinding. Nylon brush is generally, the length and hardness of the brush must be carefully studied.

Using two polishing brush roller, on top of the conveyor belt, and belt conveying direction of rotation in the opposite direction, but if the polishing brush roller pressure is too large, the substrate will be greatly elongated and tension, which is one of the important causes of size change.

If the surface treatment of copper foil is not clean, then the adhesion with the resist mask is poor, so it will reduce the pass rate of the etching process. Recently, due to the improvement of the quality of the copper plate, the surface cleaning process can be omitted in the case of a single circuit. But 1OO m below the precision graphics, surface cleaning is an essential process.

Five PCB reliability design method

Electronic equipment used in all kinds of electronic equipment and systems are still in printed circuit board as the main assembly way.Practice has proved that even if the circuit principle diagram design is correct,Printed circuit board design undeserved, also can produce adverse effect on the reliability of electronic equipment.For example, if the two parallel lines in close proximity, PCB will form the signal delay, reflection noise in transmission line terminal formation.Therefore, in the design of the printed circuit board, should pay attention to the right way.
1.ground design in electronic equipment, earthing is an important way to control interference
If you can combine grounding and shielding correct use, can solve most of the interference problem.Electronic equipment in the ground structure roughly systematically, casing (block), digital earth (logically) and simulation, etc.The ground should be paid attention to in the design of the following:
(1)Correct selection of single point grounding and multi-point earthing in low frequency circuit, the signal of the working frequency is less than 1 MHZ, little impact on its inductance between wiring and devices,The grounding circuit had a greater influence on the formation of the circulation of interference, thus should use one-point earthing.When the working frequency of the signal is more than 10 MHZ, ground impedance becomes large, at this point should try to reduce the ground impedance, nearby multipoint earthing should be adopted.When the working frequency in 1 ~ 10 MHZ, if the grounding, the ground wire length should not exceed 1/20 of the wavelength, otherwise the multipoint earthing method should be adopted.
(2)Separate digital circuit and analog circuit.Circuit board has both high speed logic circuit, and linear circuit, should make them apart as far as possible, and both ground not mixed, respectively connected to the power end ground.Try to increase the grounding area of linear circuit.
(3)Bold grounding line as far as possible if the ground wire is very thin, grounding potential changes over electric current, the timing signal level instability of the electronic equipment, noise resistance worse.Therefore earth wire should be bold as far as possible, make it can pass three allows current in printed circuit board.If possible, the width of the ground wire should be greater than 3 mm.
(4)Earth wire will constitute a closed loop road design only composed of a digital circuit PCB ground system, to make the grounding line closed loop road can obviously improve the ability to resist noise.The reason for this is that there are many integrated circuit components on printed circuit board, especially in case of more components, power consumption due to restrictions of the grounding line thickness, can produce large potential difference on the knot, cause anti-noise ability to drop, if the grounding structure into the loop, would be to reduce the potential difference value, improve the ability to resist noise electronic equipment.
2.the electromagnetic compatibility design
Electromagnetic compatibility is refers to the electronic equipment in various kinds of electromagnetic environment is still able to coordination, ability to work effectively.Electromagnetic compatibility design of the purpose is to make electronic devices can inhibit a variety of external interference, make the electronic equipment can work normally in the specific electromagnetic environment, and also can reduce the electronic device itself electromagnetic interference to other electronic equipment.
（1）Choose the reasonable width of wire.Due to transient current impact on the printed line produced by the interference is mainly caused by printed conductor inductance components, therefore should minimize the inductance of printed wiring.Printed conductor inductance is proportional to its length, its width is inversely proportional to, so the short and fine wires is favorable to suppress interference.Clock, lead line drive or bus driver signal often contains large transient current, printed wiring to short as possible.For discrete component circuit, printed wiring width at around 1.5 mm, can fully meet the requirements;For integrated circuits, printed wiring width can choose between 0.2 ~ 1.0 mm.
（2）Adopt the strategy of the correct wiring.Using equal linear conductor inductance can be reduced, but the mutual inductance between conductor and distributed capacitance increases, if allow layout, had better use well glyph structure, network cabling concrete side lateral approach is printed circuit board wiring, the other side vertical wiring, then in the cross hole is connected with metallized hole.In order to prevent the PCB cross talk between wires, when designing the wiring should try to avoid long distance equal walk the line, the distance between the lines to open and as far as possible, signal wire and ground wire and the power cord as far as possible, don't cross.In some very sensitive to interference signal lines between a grounded printing line, can effectively restrain cross talk.
In order to avoid the high frequency signal through printed wiring of electromagnetic radiation, the printed circuit board wiring, also should pay attention to the following:
●Try to reduce the discontinuity of printed wiring, such as wire width don't mutation, the wire should be greater than 90 degrees of corner ban ring line etc.
●Clock signal leads the most susceptible to electromagnetic radiation interference, go line should close, with different ground loop drive should be close to the connector.
●The bus driver should be close to its desire to drive the bus.For those who leave the printed circuit board, and lead the drive should be tightly close to the connector.
●Data bus wiring should be every two signal lines between a signal ground.Best is tightly close to the least important address fuses placed ground loops, which often contains high frequency current.
●In PCB layout, high speed, medium speed and low speed logic circuit should be arranged device
（3）Reflection interference suppression.In order to prevent the reflection interference appears in the printed line terminal, in addition to the special needs, should as far as possible, shorten the length of the printed line and adopting slow circuit.Add terminal matching when necessary, that is, at the end of the transmission line to ground and added a different power supply side resistance matching resistance.According to the experience, generally faster TTL circuit, when the printed line longer than 10 cm above the terminal matching measures should be adopted.Matching resistance value should be based on the output of the integrated circuit drive current and the maximum absorption current to decide.
3.decoupling capacitor configuration
In dc power supply circuit, the change of the load will cause the power supply noise.As in digital circuits, when the circuit from one state into another state, will be on the power line to produce a large peak currents, the formation of the noise of the transient voltage.Configuration decoupling capacitor can restrain the noise due to load changes, is the reliability of the printed circuit board design of a conventional practice, configuration principle is as follows:
●Power input end of the jumper a 10 to 100 uf electrolytic capacitor, the position of the printed circuit board permitting, adoption of more than 100 uf electrolytic capacitor anti-interference effect will be better.
●For each of the integrated circuit chip configuration a 0.01 uF ceramic capacitor.If printed circuit board and a small space, can every 4 ~ 10 chip configuration a 1 ~ 10 uf tantalum electrolytic capacitor, this particularly small high frequency impedance of the device in 500 KHZ ~ 20 MHZ range impedance is less than 1 Ω, and leakage current is very small (below 0.5 uA).
●For weak noise, shut off the current change device and ROM, RAM, storage devices, such as should be the power cord of the chip (Vcc) and ground (GND) direct access to the decoupling capacitor.
●Decoupling capacitor lead cannot too long, especially high frequency bypass capacitors can't lead