Analysis of circuit board welding defects

There are three main factors that cause welding defects:

*The weldability of the hole affects the welding quality.

It will cause weld defects if the hole welding is not good, affect the component parameters in a circuit, and lead to the instability of multilayer board components and inner conductor, and finally cause failure of the entire circuit function. The so-called weldability is that the metal surface is wetted by the molten solder, that is, the solder metal surface to form a relatively uniform and continuous smooth film.

*Weld defects due to warping

Circuit board and components in the process of welding warp, due to the stress deformation and weld defects such as short circuit. Warpage is often due to the temperature of the upper and lower parts of the circuit board caused by the imbalance of the board itself due to the weight of the warp.

*PCB design affects welding quality

In the layout, the size of the circuit board is too large, the printing line is long, the impedance increases, the anti noise ability drops, the cost increases.

How to optimize the PCB file?

1.Shorten the connection between high frequency components, reduce EMI interference.

2.A heavy weight (e.g., over 20G) element, which is supported by a bracket, and then welded

3.Heating element to consider the problem of heat dissipation, heat sensitive components away from the heat source.

4.The arrangement of the elements is as parallel as possible, so that the utility model can be beautiful and easy to weld, and is suitable for mass production.