Along with the computer run speed rise, between the central processor and the peripheral component information transmission and the signal deposit and withdrawal needs in extremely short instantaneous to complete.For example within nanosecond or shorter time (10-9 second ~10-10 second).
These the fast transmission signal are carries on between the chip in the printed circuit panel metallic conductor.It is well known, signal dissemination demand time.The detention influence speeds up along with the frequency enlarges.Signal delay in electric circuit panel biggest, is small on multi-chip module (MCM), is smallest on the chip.Therefore the MCM technology is suitable for the high performance system.Is the 90's hot spots.In here us wants to point out the MCM technology arrived this new century to wither largely, its reason was the production cost too is expensive.
These the fast transmission signal are carries on between the chip in the printed circuit panel metallic conductor.It is well known, signal dissemination demand time.The detention influence speeds up along with the frequency enlarges.Signal delay in electric circuit panel biggest, is small on multi-chip module (MCM), is smallest on the chip.Therefore the MCM technology is suitable for the high performance system.Is the 90's hot spots.In here us wants to point out the MCM technology arrived this new century to wither largely, its reason was the production cost too is expensive.
The present 3D chip superimposition technology looked like substitutes the MCM technology.In order to reduce the signal delay, may the component which corresponds mutually draw close to the placement.
Reduces between as far as possible them the signal path of propagation.This proposed to the electric circuit board the microminiaturized request, reduces the foundation plate 'OR' circuit board material the dielectric constant to increase the signal running rate.This proposed to the electric circuit board the microminiaturized request, reduces the foundation plate 'OR' circuit board material the dielectric constant to increase the signal running rate.In order to satisfy the component which mutually will correspond to draw close to the placement the request, will have to make the high density interconnection foundation plate/electric circuit board.
Most components will interlock in the smallest space.Is uses the micro channel interconnection technique in the technical stratification plane and unifies the precise narrow spacing metal fine lace technology.
Reduces between as far as possible them the signal path of propagation.This proposed to the electric circuit board the microminiaturized request, reduces the foundation plate 'OR' circuit board material the dielectric constant to increase the signal running rate.This proposed to the electric circuit board the microminiaturized request, reduces the foundation plate 'OR' circuit board material the dielectric constant to increase the signal running rate.In order to satisfy the component which mutually will correspond to draw close to the placement the request, will have to make the high density interconnection foundation plate/electric circuit board.
Most components will interlock in the smallest space.Is uses the micro channel interconnection technique in the technical stratification plane and unifies the precise narrow spacing metal fine lace technology.
The thing often has the duality, besides the manufacture difficulty, the thin metal wire does not favor the transmission high speed signal.Leading
The wire is thinner, the high speed signal passes ability is lower.Therefore in design high speed movement system time must the concurrently density and the speed request.When to high speed signal transmission line, must use certain section according to the signal velocity request the heavy line.And maintains the enough line spacing to prevent the disturbance between the signal.
The wire is thinner, the high speed signal passes ability is lower.Therefore in design high speed movement system time must the concurrently density and the speed request.When to high speed signal transmission line, must use certain section according to the signal velocity request the heavy line.And maintains the enough line spacing to prevent the disturbance between the signal.
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